Invention Grant
- Patent Title: Antenna module and wireless communication apparatus
- Patent Title (中): 天线模块和无线通信装置
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Application No.: US13343958Application Date: 2012-01-05
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Publication No.: US08711039B2Publication Date: 2014-04-29
- Inventor: Shozo Horisawa , Kanahiro Shirota , Tsuguharu Miura
- Applicant: Shozo Horisawa , Kanahiro Shirota , Tsuguharu Miura
- Applicant Address: JP
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Priority: JPP2011-004270 20110112
- Main IPC: H01Q1/24
- IPC: H01Q1/24

Abstract:
An antenna module includes a base member made of a resin and a copper-foil material, a first ground layer formed on a first surface of the base member, a second ground layer formed on a second surface of the base member, and an inverted-F metal-plate antenna provided on the first surface, formed by punch-cutting and folding a metal plate and including a rectangular conductive plate, a grounding conductor portion connected to the first ground layer, and a feeding conductor portion connected to a feeding point. The rectangular conductive plate is folded at a folding portion extending in a length direction and is divided in a width direction at the folding portion into a first rectangular conductive plate and a second rectangular conductive plate. The first rectangular conductive plate is parallel to the base member whereas the second rectangular conductive plate is inclined to the base member.
Public/Granted literature
- US20120176275A1 ANTENNA MODULE AND WIRELESS COMMUNICATION APPARATUS Public/Granted day:2012-07-12
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