Invention Grant
- Patent Title: Packet bundling at the PDCP layer
- Patent Title (中): 分组捆绑在PDCP层
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Application No.: US12652636Application Date: 2010-01-05
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Publication No.: US08711881B2Publication Date: 2014-04-29
- Inventor: Siddharth Ray , Ashwin Sampath
- Applicant: Siddharth Ray , Ashwin Sampath
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agent Nerrie M. Zohn
- Main IPC: H04J3/22
- IPC: H04J3/22

Abstract:
Certain aspects of the present disclosure provide a technique for bundling the received service data units (SDU) in a first communication layer to generate a protocol data unit (PDU) to pass to a second communication layer. For example, one or more packet data convergence protocol (PDCP) SDUs may be concatenated to generate a PDCP PDU and be sent to a radio link control (RLC) layer in the transmitter side. Similarly, one or more PDCP SDUs may be extracted from a PDCP PDU in the receiver side.
Public/Granted literature
- US20100208632A1 PACKET BUNDLING AT THE PDCP LAYER Public/Granted day:2010-08-19
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