Invention Grant
- Patent Title: Integrated wire carrier for electrode array
- Patent Title (中): 电极阵列集成线载体
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Application No.: US12506964Application Date: 2009-07-21
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Publication No.: US08712554B2Publication Date: 2014-04-29
- Inventor: Timothy Beerling , Chuladatta Thenuwara
- Applicant: Timothy Beerling , Chuladatta Thenuwara
- Applicant Address: US CA Valencia
- Assignee: Advanced Bionics
- Current Assignee: Advanced Bionics
- Current Assignee Address: US CA Valencia
- Agency: Van Cott, Bagley, Cornwall & McCarthy P.C.
- Agent Steven L. Nichols
- Main IPC: A61N1/00
- IPC: A61N1/00

Abstract:
A cochlear lead includes a plurality electrodes forming an electrode array configured to stimulate an auditory nerve from within a cochlea; a lead body connected to the electrode array; a plurality of wires passing through the lead body and connecting to the plurality of electrodes; an integrated wire carrier extending between an exit of the wires from the lead body and a first electrode in the electrode array, the integrated wire carrier comprising a cavity along its longitudinal axis configured to contain the plurality of wires and shape the plurality of wires into a wire bundle in which the plurality of wires passing through the integrated wire carrier are substantially parallel to the longitudinal axis of the integrated wire carrier; and a flexible body encapsulating the integrated wire carrier and the wires.
Public/Granted literature
- US20110022145A1 INTEGRATED WIRE CARRIER FOR ELECTRODE ARRAY Public/Granted day:2011-01-27
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