Invention Grant
- Patent Title: Clay model support device
- Patent Title (中): 粘土模型支撑装置
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Application No.: US13035439Application Date: 2011-02-25
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Publication No.: US08714533B2Publication Date: 2014-05-06
- Inventor: Mark Jenkins
- Applicant: Mark Jenkins
- Applicant Address: JP Tokyo
- Assignee: Honda Motor Co., Ltd.
- Current Assignee: Honda Motor Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Rankin, Hill & Clark LLP
- Main IPC: B23Q1/00
- IPC: B23Q1/00 ; B25B1/00 ; B66F3/00

Abstract:
A clay model support device includes a base, a support frame connected with the base, and a panel connected with the support frame. The base includes a lower surface configured to engage an associated horizontal floor surface. The support frame is pivotable with respect to the base about a generally horizontal axis. The panel is configured to support an associated clay model. The panel is slidable with respect to the support frame.
Public/Granted literature
- US20120217690A1 CLAY MODEL SUPPORT DEVICE Public/Granted day:2012-08-30
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