发明授权
- 专利标题: High speed high density connector assembly
- 专利标题(中): 高速高密度连接器总成
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申请号: US13437886申请日: 2012-04-02
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公开(公告)号: US08715005B2公开(公告)日: 2014-05-06
- 发明人: Feng Pan
- 申请人: Feng Pan
- 申请人地址: TW New Taipei
- 专利权人: Hon Hai Precision Industry Co., Ltd.
- 当前专利权人: Hon Hai Precision Industry Co., Ltd.
- 当前专利权人地址: TW New Taipei
- 代理商 Ming Chieh Chang; Wei Te Chung
- 优先权: CN201110080651 20110331
- 主分类号: H01R13/648
- IPC分类号: H01R13/648
摘要:
A high speed connector assembly includes a header and a receptacle. The header includes an array of first contacts arranged in lines and columns, each line of first contacts being grouped in pairs, each of the first contacts having a contacting portion and a number of first shields arranged besides corresponding lines of the first contacts, each of the first shields having a contacting portion. The receptacle has a main body. The main body defines a front face and a number of receiving holes in the front face. The contact portions of each pair of the first contacts and corresponding first shield are received in the same one of the receiving holes when the header and the receptacle are mated.
公开/授权文献
- US20120252271A1 HIGH SPEED HIGH DENSITY CONNECTOR ASSEMBLY 公开/授权日:2012-10-04
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