发明授权
- 专利标题: Method for manufacturing resin film for thin film-capacitor and the film therefor
- 专利标题(中): 薄膜电容器用树脂薄膜及其薄膜的制造方法
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申请号: US12980953申请日: 2010-12-29
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公开(公告)号: US08715554B2公开(公告)日: 2014-05-06
- 发明人: Takashi Nogami , Kenro Takizawa , Kazuhiro Suzuki , Junya Ishida
- 申请人: Takashi Nogami , Kenro Takizawa , Kazuhiro Suzuki , Junya Ishida
- 申请人地址: JP Tokyo
- 专利权人: Shin-Etsu Polymer Co., Ltd.
- 当前专利权人: Shin-Etsu Polymer Co., Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: Arent Fox LLP
- 优先权: JP2010-050624 20100308
- 主分类号: B29C47/14
- IPC分类号: B29C47/14
摘要:
The present invention provides a resin film for a film capacitor making it possible to obtain the excellent heat resistance, materialize a reduction in a size of the film capacitor and an increase in a capacity thereof and satisfy a reduction in a thickness of the film and a high voltage resistance thereof. In a manufacturing method in which an extruding equipment 10 is charged with a molding material 1 to extrude a film 2 for a film capacitor from a T dice 20, in which the above extruded film 2 for a film capacitor is interposed between plural rolls in a receiving device 30 and cooled and in which the above cooled film 2 for a film capacitor is wound on a winding tube 42 of a winding device 40, 100 parts by mass of a polyetherimide resin is blended with 1 to 10 parts by mass of a fluorocarbon resin to prepare the molding material 1; the above molding material 1 is extruded through a filter 50 having apertures 51 which are 0.5 to 6 times or less as large as an average thickness of the film 2 for a film capacitor, which is provided between the extruding equipment 10 and the T dice 20; and a thickness of the film 2 for a film capacitor is controlled to 10 μm or less.