发明授权
- 专利标题： System-in-package platform for electronic-microfluidic devices
- 专利标题（中）： 电子微流体装置的系统级封装平台
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申请号： US13755293申请日： 2013-01-31
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公开(公告)号： US08715592B2公开(公告)日： 2014-05-06
- 发明人: Ronald Dekker , Remco Henricus Wilhelmus Pijnenburg , Nicolaas Johannes Anthonius Van Veen
- 申请人： Ronald Dekker , Remco Henricus Wilhelmus Pijnenburg , Nicolaas Johannes Anthonius Van Veen
- 申请人地址： NL Eindhoven
- 专利权人： Koninklijke Philips N.V.
- 当前专利权人： Koninklijke Philips N.V.
- 当前专利权人地址： NL Eindhoven
- 优先权： EP06111392 20060320
- 主分类号： G01N15/06
- IPC分类号： G01N15/06
摘要：
An integrated electronic-micro fluidic device an integrated electronic-micro fluidic device, comprising a semiconductor substrate on a first support, an electronic circuit on a first semiconductor-substrate side of the semiconductor substrate, and a signal interface structure to an external device. A micro fluidic structure is formed in the semiconductor substrate, and is configured to confine a fluid and to allow a flow of the fluid to and from the microfluidic structure only on a second semiconductor-substrate side that is opposite to the first semiconductor-substrate side and faces away from the first support.