A wafer comprises a transducer having an air-bearing surface (ABS) and including a magnetic structure characterized by a desired thickness, and having a bevel and a flare point a first distance from the ABS. The wafer further comprises a first electronic lapping guide (ELG), a second ELG, and a third ELG. The first ELG has a first edge a first distance from the ABS and a second edge a second distance from the ABS. The second ELG has a third edge a third distance from the ABS and a fourth edge the second distance from the ABS. The third ELG has a fifth edge a fourth distance from the ABS and a sixth edge the second distance from the ABS. At least one of the first distance and the second distance, at least one of the third distance and the second distance, and at least one of the fourth distance and the second distance correspond to an intersection between the bevel and the desired thickness.