Invention Grant
- Patent Title: Memory module
- Patent Title (中): 内存模块
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Application No.: US13899844Application Date: 2013-05-22
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Publication No.: US08717837B2Publication Date: 2014-05-06
- Inventor: Frederick A. Ware , Ely K. Tsern , Richard E. Perego , Craig E. Hampel
- Applicant: Rambus Inc.
- Applicant Address: US CA Sunnyvale
- Assignee: Rambus Inc.
- Current Assignee: Rambus Inc.
- Current Assignee Address: US CA Sunnyvale
- Agent Charles Shemwell
- Main IPC: G11C7/00
- IPC: G11C7/00

Abstract:
A memory module having memory components, a termination structure, an address/control signal path, a clock signal path, multiple data signal paths and multiple strobe signal paths. The strobe signal paths and data signal paths are coupled to respective memory components, and the address/control signal path and clock signal path are coupled in common to all the memory components. The address/control signal path extends along the memory components to the termination structure such that control signals propagating toward the termination structure arrive at address/control inputs of respective memory components at progressively later times corresponding to relative positions of the memory components.
Public/Granted literature
- US20130250706A1 MEMORY MODULE Public/Granted day:2013-09-26
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