Invention Grant
- Patent Title: Manufacturing process for solid state lighting device on a conductive substrate
- Patent Title (中): 导电基板上固态照明装置的制造工艺
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Application No.: US13489955Application Date: 2012-06-06
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Publication No.: US08722441B2Publication Date: 2014-05-13
- Inventor: Shaoher X. Pan , Jay Chen
- Applicant: Shaoher X. Pan , Jay Chen
- Applicant Address: US CA Palo Alto
- Assignee: SiPhoton Inc.
- Current Assignee: SiPhoton Inc.
- Current Assignee Address: US CA Palo Alto
- Agency: Fish & Richardson P.C.
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A method for fabricating a light emitting device includes forming a trench in a first surface on first side of a substrate. The trench comprises a first sloped surface not parallel to the first surface, wherein the substrate has a second surface opposite to the first surface of the substrate. The method also includes forming alight emission layer over the first trench surface, but not over the remainder of the first substrate surface, and removing at least a portion of the substrate from the second side of the substrate to expose the light emission layer and allow it to emit light out of the protrusion or protrusions on the second side of the substrate. These protrusions may be elongated pyramids.
Public/Granted literature
- US20120241809A1 MANUFACTURING PROCESS FOR SOLID STATE LIGHTING DEVICE ON A CONDUCTIVE SUBSTRATE Public/Granted day:2012-09-27
Information query
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