发明授权
- 专利标题： Semiconductor packaging and fabrication method using connecting plate for internal connection
- 专利标题（中）： 使用连接板进行内部连接的半导体封装和制造方法
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申请号： US12722528申请日： 2010-03-12
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公开(公告)号： US08722466B2公开(公告)日： 2014-05-13
- 发明人: Jun Lu , Kai Liu , Yan Xun Xue
- 申请人： Jun Lu , Kai Liu , Yan Xun Xue
- 申请人地址： US CA Sunnyvale
- 专利权人： Alpha & Omega Semiconductor, Inc.
- 当前专利权人： Alpha & Omega Semiconductor, Inc.
- 当前专利权人地址： US CA Sunnyvale
- 代理机构： C H Emily LLC
- 代理商 Chein-Hwa Tsao
- 主分类号： H01L21/44
- IPC分类号： H01L21/44 ; H01L21/48 ; H01L21/50
摘要：
A semiconductor package with connecting plate for internal connection comprise: a plurality of chips each having a plurality of contact areas on a top surface; one or more connecting plates having a plurality of electrically isolated connecting plate portions each connecting a contact area of the semiconductor chips. The method of making the semiconductor package includes the steps of connecting one or more connecting plates to a plurality of semiconductor chips, applying a molding material to encapsulate the chips and the connecting plates, separating a plurality of connecting plate portions of the connecting plates by shallow cutting through or by grinding.
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