Invention Grant
- Patent Title: Transistors having argon gate implants and methods of forming the same
- Patent Title (中): 具有氩门浇注的晶体管及其形成方法
-
Application No.: US13751537Application Date: 2013-01-28
-
Publication No.: US08722480B2Publication Date: 2014-05-13
- Inventor: F. Daniel Gealy , Suraj J. Mathew , Cancheepuram V. Srividya
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Dickstein Shapiro LLP
- Main IPC: H01L27/11
- IPC: H01L27/11 ; H01L27/092

Abstract:
Transistors are provided including first and second source/drain regions, a channel region and a gate stack having a first gate dielectric over a substrate, the first gate dielectric having a dielectric constant higher than a dielectric constant of silicon dioxide, and a metal material in contact with the first gate dielectric, the metal material being doped with an inert element. Integrated circuits including the transistors and methods of forming the transistors are also provided.
Public/Granted literature
- US20130164897A1 TRANSISTORS HAVING ARGON GATE IMPLANTS AND METHODS OF FORMING THE SAME Public/Granted day:2013-06-27
Information query
IPC分类: