发明授权
- 专利标题: Method of selectively deglazing P205
- 专利标题(中): 选择性降温P205的方法
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申请号: US13595933申请日: 2012-08-27
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公开(公告)号: US08722545B2公开(公告)日: 2014-05-13
- 发明人: Hong-Gap Chua , Yee-Chung Chan , Mei-Yu Muk
- 申请人: Hong-Gap Chua , Yee-Chung Chan , Mei-Yu Muk
- 申请人地址: SG Singapore
- 专利权人: STMicroelectronics Pte Ltd.
- 当前专利权人: STMicroelectronics Pte Ltd.
- 当前专利权人地址: SG Singapore
- 代理机构: Seed IP Law Group PLLC
- 主分类号: H01L21/302
- IPC分类号: H01L21/302 ; H01L21/22
摘要:
A method of forming a transistor is disclosed, in which gate-to-substrate leakage is addressed by forming and maintaining a conformal oxide layer overlying the transistor gate. Using the method disclosed for an n-type device, the conformal oxide layer can be formed as part of the source-drain doping process. Subsequent removal of residual phosphorous dopants from the surface of the oxide layer is accomplished without significant erosion of the oxide layer. The removal step uses a selective deglazing process that employs a hydrolytic reaction, and an acid-base neutralization reaction that includes an ammonium hydroxide component.
公开/授权文献
- US20140054727A1 METHOD OF SELECTIVELY DEGLAZING P205 公开/授权日:2014-02-27
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