Invention Grant
- Patent Title: Method of selectively deglazing P205
- Patent Title (中): 选择性降温P205的方法
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Application No.: US13595933Application Date: 2012-08-27
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Publication No.: US08722545B2Publication Date: 2014-05-13
- Inventor: Hong-Gap Chua , Yee-Chung Chan , Mei-Yu Muk
- Applicant: Hong-Gap Chua , Yee-Chung Chan , Mei-Yu Muk
- Applicant Address: SG Singapore
- Assignee: STMicroelectronics Pte Ltd.
- Current Assignee: STMicroelectronics Pte Ltd.
- Current Assignee Address: SG Singapore
- Agency: Seed IP Law Group PLLC
- Main IPC: H01L21/302
- IPC: H01L21/302 ; H01L21/22

Abstract:
A method of forming a transistor is disclosed, in which gate-to-substrate leakage is addressed by forming and maintaining a conformal oxide layer overlying the transistor gate. Using the method disclosed for an n-type device, the conformal oxide layer can be formed as part of the source-drain doping process. Subsequent removal of residual phosphorous dopants from the surface of the oxide layer is accomplished without significant erosion of the oxide layer. The removal step uses a selective deglazing process that employs a hydrolytic reaction, and an acid-base neutralization reaction that includes an ammonium hydroxide component.
Public/Granted literature
- US20140054727A1 METHOD OF SELECTIVELY DEGLAZING P205 Public/Granted day:2014-02-27
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