Invention Grant
- Patent Title: Conductor grid for electronic housings and manufacturing method
- Patent Title (中): 电子外壳导线栅格及制造方法
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Application No.: US13263629Application Date: 2010-03-29
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Publication No.: US08723032B2Publication Date: 2014-05-13
- Inventor: Lorenz Berchtold
- Applicant: Lorenz Berchtold
- Applicant Address: DE Bensheim
- Assignee: Tyco Electronics AMP GmbH
- Current Assignee: Tyco Electronics AMP GmbH
- Current Assignee Address: DE Bensheim
- Agency: Faegre Baker Daniels LLP
- Priority: DE102009016842 20090408
- International Application: PCT/EP2010/054091 WO 20100329
- International Announcement: WO2010/115746 WO 20101014
- Main IPC: H02G3/08
- IPC: H02G3/08
Abstract:
With the present invention, conductor grids for electronic housings and a manufacturing method for such conductor grids are provided. According to the invention, the conductor grid is produced from two metal strips (130, 110, 140) welded along the joint edge (150), with only one of the two metal strips needing to have a surface suitable for the wire bonding. The amount of the conventionally used, plated starting material can be considerably reduced in this way.
Public/Granted literature
- US20120018187A1 CONDUCTOR GRID FOR ELECTRONIC HOUSINGS AND MANUFACTURING METHOD Public/Granted day:2012-01-26
Information query
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