Packaged integrated circuit devices with through-body conductive vias, and methods of making same

Invention Grant

US08723307B2 Packaged integrated circuit devices with through-body conductive vias, and methods of making same 有权

Title translation: 具有通孔导电通孔的封装集成电路器件及其制造方法

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Patent Title: Packaged integrated circuit devices with through-body conductive vias, and methods of making same
Patent Title (中): 具有通孔导电通孔的封装集成电路器件及其制造方法
Application No.: US12852925

Application Date: 2010-08-09
Publication No.: US08723307B2

Publication Date: 2014-05-13
Inventor: Tongbi Jiang , Yong Poo Chia
Applicant: Tongbi Jiang , Yong Poo Chia
Applicant Address: US ID Boise
Assignee: Micron Technology, Inc.
Current Assignee: Micron Technology, Inc.
Current Assignee Address: US ID Boise
Agency: Perkins Coie LLP
Main IPC: H01L23/04
IPC: H01L23/04

Packaged integrated circuit devices with through-body conductive vias, and methods of making same

Abstract:

A device is disclosed which includes at least one integrated circuit die, at least a portion of which is positioned in a body of encapsulant material, and at least one conductive via extending through the body of encapsulant material.

Abstract(Chinese):

公开了一种装置，其包括至少一个集成电路管芯，其至少一部分位于密封材料的主体中，以及延伸穿过密封材料本体的至少一个导电通孔。

Public/Granted literature

US20100320585A1 PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VIAS, AND METHODS OF MAKING SAME Public/Granted day:2010-12-23

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L23/00	半导体或其他固态器件的零部件（H01L25/00优先）
H01L23/02	.容器；封接（H01L23/12，H01L23/34，H01L23/48，H01L23/552优先）
H01L23/04	..按外形区分的