发明授权
- 专利标题： Housing for electronic device and method for making the same
- 专利标题（中）： 电子设备外壳及其制造方法
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申请号： US13089417申请日： 2011-04-19
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公开(公告)号： US08726485B2公开(公告)日： 2014-05-20
- 发明人: Zhu-Sha Weng , Yong-Gang Zhu
- 申请人： Zhu-Sha Weng , Yong-Gang Zhu
- 申请人地址： CN Shenzhen HK Kowloon
- 专利权人： Shenzhen Futaihong Precision Industry Co., Ltd.,FIH (Hong Kong) Limited
- 当前专利权人： Shenzhen Futaihong Precision Industry Co., Ltd.,FIH (Hong Kong) Limited
- 当前专利权人地址： CN Shenzhen HK Kowloon
- 代理机构： Novak Druce Connolly Bove + Quigg LLP
- 优先权： CN201110066155 20110318
- 主分类号： B21B1/46
- IPC分类号： B21B1/46 ; B21B13/22 ; B22D11/126 ; B22D11/128 ; B23P17/00 ; B23P25/00
摘要：
A housing for an electronic device includes a base and a pattern layer formed on the base. The pattern layer includes a blasting area and peripheral area, the blasting area has rough surface formed by sandblasting, the blasting area is a pattern section and has a width of at least 70 micrometer; the peripheral area has a slippery surface a peripheral section of the pattern section. The disclosure also described a method to make the housing.
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