Invention Grant
- Patent Title: Curing agent composition
- Patent Title (中): 固化剂组成
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Application No.: US13263368Application Date: 2010-04-07
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Publication No.: US08729152B2Publication Date: 2014-05-20
- Inventor: Masahiko Kagitani , Hitoshi Funada
- Applicant: Masahiko Kagitani , Hitoshi Funada
- Applicant Address: JP Tokyo
- Assignee: Kao Corporation
- Current Assignee: Kao Corporation
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2009-096217 20090410
- International Application: PCT/JP2010/056326 WO 20100407
- International Announcement: WO2010/117022 WO 20101014
- Main IPC: B22C9/00
- IPC: B22C9/00
Abstract:
A curing agent composition for a water-soluble phenol resin used to produce a mold, which comprises a branched ester compound that is derived from a carboxylic acid having a branched chain, and an alcohol, and has 5 to 13 carbon atoms.
Public/Granted literature
- US20120043694A1 CURING AGENT COMPOSITION Public/Granted day:2012-02-23
Information query
