发明授权
- 专利标题： Power module package and method for fabricating the same
- 专利标题（中）： 电源模块封装及其制造方法
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申请号： US13235176申请日： 2011-09-16
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公开(公告)号： US08729683B2公开(公告)日： 2014-05-20
- 发明人: Kwang Soo Kim , Ji Hyun Park , Young Ki Lee , Seog Moon Choi
- 申请人： Kwang Soo Kim , Ji Hyun Park , Young Ki Lee , Seog Moon Choi
- 申请人地址： KR Gyunggi-Do
- 专利权人： Samsung Electro-Mechanics Co., Ltd
- 当前专利权人： Samsung Electro-Mechanics Co., Ltd
- 当前专利权人地址： KR Gyunggi-Do
- 代理机构： Ladas & Parry, LLP
- 优先权： KR10-2011-0058468 20110616
- 主分类号： H01L23/495
- IPC分类号： H01L23/495
摘要：
Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: first and second lead frames arranged to face each other, both or either of the first and second frames being made of aluminum; anodized layers formed on portions of the lead frame(s) made of aluminum in the first and second lead frames; and semiconductor devices mounted on first surfaces of the first and second lead frames.
公开/授权文献
- US20120319259A1 POWER MODULE PACKAGE AND METHOD FOR FABRICATING THE SAME 公开/授权日：2012-12-20