发明授权
US08729705B2 Seal ring structures with reduced moisture-induced reliability degradation
有权
密封环结构具有减少的水分诱导的可靠性降低
- 专利标题： Seal ring structures with reduced moisture-induced reliability degradation
- 专利标题（中）： 密封环结构具有减少的水分诱导的可靠性降低
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申请号： US14132373申请日： 2013-12-18
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公开(公告)号： US08729705B2公开(公告)日： 2014-05-20
- 发明人: Chien-Jung Wang , Jian-Hong Lin
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater & Matsil, L.L.P.
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/52 ; H01L29/40
摘要：
A semiconductor chip includes a seal ring adjacent to edges of the semiconductor chip; an opening extending from a top surface to a bottom surface of the seal ring, wherein the opening has a first end on an outer side of the seal ring and a second end on an inner side of the seal ring; and a moisture barrier having a sidewall parallel to a nearest side of the seal ring, wherein the moisture barrier is adjacent the seal ring and has a portion facing the opening.
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