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US08730369B2 Wafer level camera module and method of manufacture 有权
晶圆级相机模块及制造方法

Wafer level camera module and method of manufacture
摘要:
A method includes forming optical lenses on an ICD at the wafer level, rather than attaching a separate lens assembly. The lenses may be formed as an array of individual lenses or as multiple, e.g., two, arrays of individual lenses. The array of lenses may be coupled to an array of ICDs. The ICDs and individual lenses in the array assembly may be singulated to form individual digital camera modules. Additionally or alternatively, the ICDs and individual lenses may be singulated in separate steps.
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