发明授权
- 专利标题: Wafer level camera module and method of manufacture
- 专利标题(中): 晶圆级相机模块及制造方法
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申请号: US13909808申请日: 2013-06-04
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公开(公告)号: US08730369B2公开(公告)日: 2014-05-20
- 发明人: Harpuneet Singh
- 申请人: DigitalOptics Corporation
- 申请人地址: US CA San Jose
- 专利权人: DigitalOptics Corporation
- 当前专利权人: DigitalOptics Corporation
- 当前专利权人地址: US CA San Jose
- 代理机构: Henneman & Associates, PLC
- 代理商 Larry E. Henneman, Jr.; Gregory P. Gibson
- 主分类号: G02B13/16
- IPC分类号: G02B13/16 ; H04N5/225 ; H01L31/0203
摘要:
A method includes forming optical lenses on an ICD at the wafer level, rather than attaching a separate lens assembly. The lenses may be formed as an array of individual lenses or as multiple, e.g., two, arrays of individual lenses. The array of lenses may be coupled to an array of ICDs. The ICDs and individual lenses in the array assembly may be singulated to form individual digital camera modules. Additionally or alternatively, the ICDs and individual lenses may be singulated in separate steps.
公开/授权文献
- US20130265481A1 WAFER LEVEL CAMERA MODULE AND METHOD OF MANUFACTURE 公开/授权日:2013-10-10
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