发明授权
- 专利标题： Solder ball bridge, and methods of making
- 专利标题（中）： 焊球桥和制作方法
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申请号： US13544067申请日： 2012-07-09
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公开(公告)号： US08730621B2公开(公告)日： 2014-05-20
- 发明人: Jackson William Brandts , Kevin J. Schulz , Christopher Michael Unger
- 申请人： Jackson William Brandts , Kevin J. Schulz , Christopher Michael Unger
- 申请人地址： US CA Cupertino
- 专利权人： Seagate Technology LLC
- 当前专利权人： Seagate Technology LLC
- 当前专利权人地址： US CA Cupertino
- 代理机构： HolzerIPLaw, PC
- 主分类号： G11B5/127
- IPC分类号： G11B5/127
摘要：
An electrical connection between a first element and a second element formed by a solder ball bridge having at least three solder balls in physical contact with each other extending to electrically connect the first element and the second element. The solder ball bridge is particularly suitable for a disc drive system, to form an electrical connection between two elements such as between a piezoelectric microactuator element and the suspension assembly. Methods of making a solder ball bridge are also provided.
公开/授权文献
- US20140008101A1 SOLDER BALL BRIDGE, AND METHODS OF MAKING 公开/授权日：2014-01-09
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