Invention Grant
US08730677B2 Method of cooling electronic circuit boards using surface mounted devices
有权
使用表面安装装置冷却电子电路板的方法
- Patent Title: Method of cooling electronic circuit boards using surface mounted devices
- Patent Title (中): 使用表面安装装置冷却电子电路板的方法
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Application No.: US13324770Application Date: 2011-12-13
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Publication No.: US08730677B2Publication Date: 2014-05-20
- Inventor: Toni Wald , Sven Liborius
- Applicant: Toni Wald , Sven Liborius
- Applicant Address: DE Meiningen
- Assignee: Adva Optical Networking SE
- Current Assignee: Adva Optical Networking SE
- Current Assignee Address: DE Meiningen
- Agency: The Webb Law Firm
- Priority: EP11401654 20111202
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
The invention relates to a method of cooling electronic circuit boards using surface mounted devices (SMD), the method comprising the steps of: after or during the board layout, filling empty spaces V1, V2, V3, V4, V5, V6, V7, V8, V9, V10 with at a number of heat sink devices 1, 2, 3, 4, 5 near a thermal hot spot and connecting the number of heat sink devices 1, 2, 3, 4, 5 to a thermally conducting path 25, 27, 29, 31, 33, 35 of the board N, respectively. Further, the invention relates to a heat sink device 1, 2, 3, 4, 5 adapted to implement the method according to the invention.
Public/Granted literature
- US20130141873A1 Method of Cooling Electronic Circuit Boards Using Surface Mounted Devices Public/Granted day:2013-06-06
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