Invention Grant
US08731498B2 Temperature correcting an envelope power supply signal for RF PA circuitry
有权
温度校正RF PA电路的信封电源信号
- Patent Title: Temperature correcting an envelope power supply signal for RF PA circuitry
- Patent Title (中): 温度校正RF PA电路的信封电源信号
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Application No.: US13304735Application Date: 2011-11-28
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Publication No.: US08731498B2Publication Date: 2014-05-20
- Inventor: William David Southcombe , Brian Baxter , David E. Jones , Chris Levesque , Scott Yoder , Terry J. Stockert
- Applicant: William David Southcombe , Brian Baxter , David E. Jones , Chris Levesque , Scott Yoder , Terry J. Stockert
- Applicant Address: US NC Greensboro
- Assignee: RF Micro Devices, Inc.
- Current Assignee: RF Micro Devices, Inc.
- Current Assignee Address: US NC Greensboro
- Agency: Withrow & Terranova, P.L.L.C.
- Main IPC: H01Q11/12
- IPC: H01Q11/12 ; H04B1/04
Abstract:
A direct current (DC)-DC converter and radio frequency (RF) power amplifier (PA) circuitry are disclosed. The DC-DC converter provides an envelope power supply signal to the RF PA circuitry based on a first power supply output control signal. As a temperature of the RF PA circuitry changes, the envelope power supply signal may need to be adjusted to meet temperature compensation requirements of the RF PA circuitry. With adequate thermal coupling between the DC-DC converter and the RF PA circuitry, adjustments to the envelope power supply signal may be based on temperature measurements of the DC-DC converter. A desired correction of the first power supply output control signal is determined based on a measured temperature of the DC-DC converter and the temperature compensation requirements of the RF PA circuitry. The first power supply output control signal is adjusted based on the desired correction.
Public/Granted literature
- US20120299645A1 TEMPERATURE CORRECTING AN ENVELOPE POWER SUPPLY SIGNAL FOR RF PA CIRCUITRY Public/Granted day:2012-11-29
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