Invention Grant
- Patent Title: RF circuit module and panel
- Patent Title (中): RF电路模块和面板
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Application No.: US12652992Application Date: 2010-01-06
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Publication No.: US08731603B2Publication Date: 2014-05-20
- Inventor: M'hamed Anis Khemakhem , Steven Mark Swam , Jeffrey Louis Peters , Nasser Pooladian , James Stansbury
- Applicant: M'hamed Anis Khemakhem , Steven Mark Swam , Jeffrey Louis Peters , Nasser Pooladian , James Stansbury
- Applicant Address: US PA Berwyn
- Assignee: ADC Telecommunications, Inc.
- Current Assignee: ADC Telecommunications, Inc.
- Current Assignee Address: US PA Berwyn
- Agency: Merchant & Gould P.C.
- Main IPC: H04H60/09
- IPC: H04H60/09 ; H04M1/00

Abstract:
A radio frequency signal distribution module and panel for receiving such a module are disclosed. One module includes a housing having a front and a rear, a radio frequency signal input connection positioned on the rear of the housing, and a plurality of radio frequency signal output connections positioned on the rear of the housing. The module also includes a splitter within the housing and connecting the radio frequency signal input connection to the plurality of radio frequency signal output connections. Certain modules include an active attenuation component connected to and providing programmable attenuation of a radio frequency signal output connection from among the plurality of radio frequency signal output connections. Other modules include a data port on the housing, the data port configured to communicate information about radio frequency signals within the module to a computing system remote from the module.
Public/Granted literature
- US20100210236A1 RF CIRCUIT MODULE AND PANEL Public/Granted day:2010-08-19
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