A method disclosed herein includes packaging and de-packaging a part. The part is packaged by placing the part adjacent to a shape memory polymer (SMP) while the SMP is in a permanent shape. The SMP is heated to a temperature above a switching temperature of the SMP, and a force is applied to the heated SMP such that it conforms to i) a shape of the part and/or ii) a desired shape for packing the part, thereby changing the SMP from the permanent shape into a temporary shape. The SMP is cooled to a temperature below the switching temperature to set the SMP into the temporary shape. The part is de-packaged by heating the SMP to a temperature above its switching temperature, thereby reverting the SMP from the temporary shape into the permanent shape and releasing the part. The part is removed from the SMP in the permanent shape.