发明授权
- 专利标题： Packaging and de-packaging methods using shape memory polymers
- 专利标题（中）： 使用形状记忆聚合物的包装和去包装方法
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申请号： US13307494申请日： 2011-11-30
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公开(公告)号： US08733071B2公开(公告)日： 2014-05-27
- 发明人: Ingrid A. Rousseau , John N. Owens , Elisabeth J. Berger , Hamid G. Kia
- 申请人： Ingrid A. Rousseau , John N. Owens , Elisabeth J. Berger , Hamid G. Kia
- 申请人地址： US MI Detroit
- 专利权人： GM Global Technology Operations LLC
- 当前专利权人： GM Global Technology Operations LLC
- 当前专利权人地址： US MI Detroit
- 代理机构： Dierker & Associates, P.C.
- 主分类号： B65B43/00
- IPC分类号： B65B43/00 ; B65B47/00
摘要：
A method disclosed herein includes packaging and de-packaging a part. The part is packaged by placing the part adjacent to a shape memory polymer (SMP) while the SMP is in a permanent shape. The SMP is heated to a temperature above a switching temperature of the SMP, and a force is applied to the heated SMP such that it conforms to i) a shape of the part and/or ii) a desired shape for packing the part, thereby changing the SMP from the permanent shape into a temporary shape. The SMP is cooled to a temperature below the switching temperature to set the SMP into the temporary shape. The part is de-packaged by heating the SMP to a temperature above its switching temperature, thereby reverting the SMP from the temporary shape into the permanent shape and releasing the part. The part is removed from the SMP in the permanent shape.