Invention Grant
US08734000B2 Light module, composite circuit board device used therein, and assembling method thereof
有权
光模块，其中使用的复合电路板装置及其组装方法
- Patent Title: Light module, composite circuit board device used therein, and assembling method thereof
- Patent Title (中): 光模块，其中使用的复合电路板装置及其组装方法
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Application No.: US13151356Application Date: 2011-06-02
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Publication No.: US08734000B2Publication Date: 2014-05-27
- Inventor: Hsin-Chang Chiang , Chieh-Jen Cheng , Chien-Ting Liao
- Applicant: Hsin-Chang Chiang , Chieh-Jen Cheng , Chien-Ting Liao
- Applicant Address: TW Hsin-Chu
- Assignee: Au Optronics Corporation
- Current Assignee: Au Optronics Corporation
- Current Assignee Address: TW Hsin-Chu
- Agency: McClure, Qualey & Rodack, LLP
- Priority: TW99123747A 20100720
- Main IPC: F21V7/04
- IPC: F21V7/04
Abstract:
A light module and an assembling method thereof are disclosed. The light module includes a first circuit board, a second circuit board, and a light source, wherein the first circuit board has a first opening and a second opening, and the second circuit board has a first bending portion. The light source is disposed on the first circuit board. The second circuit board passes through the first opening and the second opening of the first circuit board to form the first bending portion and the first circuit board and the second circuit board are fixed together to complete the light module assembling.
Public/Granted literature
- US20120020096A1 Light Module, Composite Circuit Board Device Used Therein, and Assembling Method Thereof Public/Granted day:2012-01-26
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