Provided are a stacked package, method of fabricating a stacked package, and method of mounting a stacked package. A method includes providing an upper semiconductor package including an upper package substrate, upper semiconductor chips formed on a top surface of the upper package substrate, and first solders formed on a bottom surface of the upper package substrate and having a first melting temperature, providing a lower semiconductor package including a lower package substrate, lower semiconductor chips formed on a top surface of the lower package substrate, and solder paste nodes formed on the top surface of the lower package substrate and having a second melting temperature lower than the first melting temperature, and forming inter-package bonding units by attaching respective first solders and solder paste nodes to each other by performing annealing at a temperature higher than the second melting temperature and lower than the first melting temperature.