A grounding system for a semiconductor module of a variable speed drive includes a first conductive layer, a second conductive layer; a substrate disposed between the first conductive layer and the second conductive layer; and a base attached to the second conductive layer, the base being connected to earth ground via a grounding harness. The first conductive layer is in electrical contact with the semiconductor module and the substrate, and electrically insulated from the second conductive layer by the substrate. The second conductive layer is in electrical contact with the substrate and disposed between the substrate and the base in electrical communication with an earth ground. The first conductive layer, the substrate and the second conductive layer form a capacitance path between the semiconductor module and the base as well as electrical conductors and the base for reduction circulating currents within the semiconductor module.