Invention Grant
- Patent Title: Method and apparatus for defect identification
- Patent Title (中): 缺陷识别方法和装置
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Application No.: US13455584Application Date: 2012-04-25
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Publication No.: US08737717B2Publication Date: 2014-05-27
- Inventor: Mei-Chun Lin , Ching-Fang Yu , Ting-Hao Hsu , Sheng-Chi Chin
- Applicant: Mei-Chun Lin , Ching-Fang Yu , Ting-Hao Hsu , Sheng-Chi Chin
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: G06K9/00
- IPC: G06K9/00

Abstract:
A method of identifying defects including producing, with an imaging system, an original image of a fabricated article having a feature thereon, the feature having an intended height and extracting a contour image from the original image, the contour image having an outline of those portions of the feature having a height approximate to the intended height. The method also includes producing a simulated image of the article based upon the contour and creating a defect image based on the differences between the simulated image and the original image, the defect image including any portions of the feature having a height less than the intended height.
Public/Granted literature
- US20130287287A1 METHOD AND APPARATUS FOR DEFECT IDENTIFICATION Public/Granted day:2013-10-31
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