Invention Grant
- Patent Title: Sample processing apparatus
- Patent Title (中): 样品处理装置
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Application No.: US13629310Application Date: 2012-09-27
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Publication No.: US08738182B2Publication Date: 2014-05-27
- Inventor: Hiroshi Kurono , Daiki Karino
- Applicant: Sysmex Corporation
- Applicant Address: JP Kobe-shi
- Assignee: Sysmex Corporation
- Current Assignee: Sysmex Corporation
- Current Assignee Address: JP Kobe-shi
- Agency: Sughrue Mion, PLLC
- Priority: JP2011-218039 20110930
- Main IPC: G05B21/00
- IPC: G05B21/00

Abstract:
A sample processing apparatus includes: a sample processing unit comprising a moving mechanism and configured to perform a sample processing operation by moving the moving mechanism; a cover configured to cover the moving mechanism of the sample processing unit; a lock mechanism configured to lock the cover to prevent the cover from being opened; and a controller configured to control the lock mechanism, wherein the controller is configured to set either of a first mode and a second mode, wherein in the first mode, the cover is kept locked after the sample processing unit has completed the sample processing operation until an instruction to unlock the cover is received from a user, and in the second mode, the cover is automatically unlocked after the sample processing unit has completed the sample processing operation.
Public/Granted literature
- US20130084212A1 SAMPLE PROCESSING APPARATUS Public/Granted day:2013-04-04
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