Invention Grant
- Patent Title: Solder injection head
- Patent Title (中): 焊接注射头
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Application No.: US13664035Application Date: 2012-10-30
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Publication No.: US08740040B2Publication Date: 2014-06-03
- Inventor: Jin Won Choi , Yon Ho You , Ki Ju Lee
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Gyunggi-Do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Gyunggi-Do
- Agency: Ladas & Parry LLP
- Priority: KR10-2012-0083764 20120731
- Main IPC: B23K1/00
- IPC: B23K1/00
Abstract:
Disclosed herein a solder injection head including: a bump material storing part having a bump material stored therein; a discharging part having one side connected to the bump material storing part and discharging the bump material to the outside; a heating part formed at at least one side of the discharging part and heating the bump material passing through the discharging part; and a press-fitting part press-fitting the bump material discharged to the outside and injecting the bump material onto a substrate.
Public/Granted literature
- US20140034707A1 SOLDER INJECTION HEAD Public/Granted day:2014-02-06
Information query
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