发明授权
- 专利标题: Electronic device enclosure
- 专利标题(中): 电子设备外壳
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申请号: US13482444申请日: 2012-05-29
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公开(公告)号: US08742256B2公开(公告)日: 2014-06-03
- 发明人: Cheng Qian , Li-Fu Xu , Hui Yu , Xin-Xiang Li , Yue-Yong Li
- 申请人: Cheng Qian , Li-Fu Xu , Hui Yu , Xin-Xiang Li , Yue-Yong Li
- 申请人地址: CN Wuhan TW New Taipei
- 专利权人: Hong Fu Jin Precision Industry (WuHan) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- 当前专利权人: Hong Fu Jin Precision Industry (WuHan) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- 当前专利权人地址: CN Wuhan TW New Taipei
- 代理机构: Novak Druce Connolly Bove + Quigg LLP
- 优先权: CN201110271056 20110914
- 主分类号: H05K5/02
- IPC分类号: H05K5/02
摘要:
An electronic device enclosure includes a rear panel and a blocking board. The rear panel comprises a front surface and a back surface opposite to the front surface. A through opening is defined in the rear panel. The blocking board comprises a main body, a first flange and a second flange opposite to the first flange. A first stopping piece is extends from the first flange. A second stopping piece is extended from the second flange. A latch portion is located on the first flange. A first protrusion is located on the second flange. The latch portion and the second protrusion extend through the through opening by being elastically deformed, the latch portion and the second protrusion abut on the front surface, and the first stopping piece and the second stopping piece abut on the back surface.
公开/授权文献
- US20130063005A1 ELECTRONIC DEVICE ENCLOSURE 公开/授权日:2013-03-14
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