Invention Grant
- Patent Title: Electromagnetic interference shielding assembly and electronic device having same
- Patent Title (中): 电磁干扰屏蔽组件及其电子装置
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Application No.: US13596061Application Date: 2012-08-28
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Publication No.: US08742267B2Publication Date: 2014-06-03
- Inventor: Hong Li
- Applicant: Hong Li
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: CN201210170689 20120529
- Main IPC: H05K9/00
- IPC: H05K9/00

Abstract:
An electromagnetic interference shielding assembly for use in an electronic device is disclosed. The electronic device includes a circuit board and an alternating current cable including one end connected to the circuit. The electromagnetic interference assembly includes an electromagnetic interference shielding plate. The circuit board is mounted on the electromagnetic interference shielding plate. The alternating current cable includes a segmental portion arranged adjacent to the electromagnetic interference shielding plate. The segmental portion extends substantially parallel to the electromagnetic interference shielding plate. The electromagnetic interference shielding plate defines a plurality of slots each extending in a direction perpendicular to an extending direction of the segmental portion of the alternating current cable. The parallel slots, as a whole, extend along the extending direction of the segmental portion and spatially corresponding to the segmental portion.
Public/Granted literature
- US20130319751A1 ELECTROMAGNETIC INTERFERENCE SHIELDING ASSEMBLY AND ELECTRONIC DEVICE HAVING SAME Public/Granted day:2013-12-05
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