Invention Grant
- Patent Title: Head part for an implantable medical device
- Patent Title (中): 可植入医疗器械的头部
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Application No.: US13361355Application Date: 2012-01-30
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Publication No.: US08742268B2Publication Date: 2014-06-03
- Inventor: Andreas Reisinger , Jeremy Glynn
- Applicant: Andreas Reisinger , Jeremy Glynn
- Applicant Address: DE Hanau
- Assignee: Heraeus Precious Metals GmbH & Co. KG
- Current Assignee: Heraeus Precious Metals GmbH & Co. KG
- Current Assignee Address: DE Hanau
- Agency: Dicke, Billig & Czaja, PLLC
- Priority: DE102011009865 20110131
- Main IPC: H02G1/00
- IPC: H02G1/00

Abstract:
An electrical bushing for use in a housing of an implantable medical device is proposed. The electrical bushing includes at least one electrically insulating base body and at least one electrical conducting element. The conducting element establishes, through the base body, at least one electrically conductive connection between an internal space of the housing and an external space. The conducting element is hermetically sealed with respect to the base body, at least in part. The at least one conducting element includes at least one cermet. The electrical bushing includes at least one head part. The head part includes at least one plug connector element that enables electrical connection of at least one plug element from the external space to the plug connector element.
Public/Granted literature
- US20120193141A1 HEAD PART FOR AN IMPLANTABLE MEDICAL DEVICE Public/Granted day:2012-08-02
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