发明授权
- 专利标题： Solder interconnect on IC chip
- 专利标题（中）： IC芯片上的焊接互连
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申请号： US13271004申请日： 2011-10-11
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公开(公告)号： US08742582B2公开(公告)日： 2014-06-03
- 发明人: Mou-Shiung Lin
- 申请人： Mou-Shiung Lin
- 申请人地址： US CA San Diego
- 专利权人： Megit Acquisition Corp.
- 当前专利权人： Megit Acquisition Corp.
- 当前专利权人地址： US CA San Diego
- 代理机构： Seyfarth Shaw LLP
- 优先权： TW93128389A 20040920
- 主分类号： H01L23/528
- IPC分类号： H01L23/528
摘要：
A semiconductor chip suited for being electrically connected to a circuit element includes a line and a bump. The bump is connected to the line and is adapted to be electrically connected to the line. A plane that is horizontal to an active surface of the semiconductor chip is defined. The area that the connection region of the line and the bump is projected on the plane is larger than 30,000 square microns or has an extension distance larger than 500 microns.
公开/授权文献
- US20120025378A1 SOLDER INTERCONNECT ON IC CHIP 公开/授权日：2012-02-02
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