Invention Grant
- Patent Title: Capacitive-stemmed capacitor
- Patent Title (中): 电容干扰电容
-
Application No.: US13143637Application Date: 2010-01-06
-
Publication No.: US08743529B2Publication Date: 2014-06-03
- Inventor: Todd Hubing , Hocheol Kwak , Haixin Ke
- Applicant: Todd Hubing , Hocheol Kwak , Haixin Ke
- Applicant Address: US SC Clemson
- Assignee: Clemson University Research Foundation
- Current Assignee: Clemson University Research Foundation
- Current Assignee Address: US SC Clemson
- Agency: Ballard Spahr LLP
- International Application: PCT/US2010/020195 WO 20100106
- International Announcement: WO2010/080786 WO 20100715
- Main IPC: H01G4/228
- IPC: H01G4/228

Abstract:
A capacitor having a stem that is designed to be inserted into a single, large-diameter via hole drilled in a printed circuit board is provided, wherein the stem may have conductive rings for making the positive and negative connections to the printed circuit board power distribution planes. Inside the capacitive stem, current, or at least a portion thereof, may be carried to the main body of the capacitor through low-inductance plates that are interleaved to maximize their own mutual inductance and, therefore, minimize the connection inductance. Alternatively, the capacitor may include a coaxial stem that forms a coaxial transmission line with the anode and cathode terminals forming the inner and outer conductors.
Public/Granted literature
- US20110304949A1 CAPACITIVE-STEMMED CAPACITOR Public/Granted day:2011-12-15
Information query