发明授权
- 专利标题： Expansion apparatus for serial advanced technology attachment dual in-line memory module and motherboard for supporting the expansion apparatus
- 专利标题（中）： 用于串行高级技术附件的扩展装置双列直插式存储模块和支持扩展装置的主板
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申请号： US13217161申请日： 2011-08-24
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公开(公告)号： US08743552B2公开(公告)日： 2014-06-03
- 发明人: Bo Tian , Kang Wu
- 申请人： Bo Tian , Kang Wu
- 申请人地址： CN Shenzhen TW New Taipei
- 专利权人： Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- 当前专利权人： Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- 当前专利权人地址： CN Shenzhen TW New Taipei
- 代理机构： Novak Druce Connolly Bove + Quigg LLP
- 优先权： CN201110225507 20110808
- 主分类号： H05K5/00
- IPC分类号： H05K5/00 ; H05K7/00 ; G06F1/16 ; H05K7/16 ; H05K1/14 ; H05K1/00 ; H05K1/18 ; H01R9/00 ; H05K1/11 ; H05K1/02 ; G06F3/06
摘要：
A motherboard assembly includes a motherboard and an expansion apparatus. The motherboard includes a first expansion slot. An edge connector is set on a bottom side of the expansion apparatus to be detachably engaged in the first expansion slot. A number of SATA interfaces and a number of second expansion slots are arranged on the expansion apparatus, and are connected to signal pins and power pins of the edge connector.
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