发明授权
- 专利标题: Method and circuit for testing a multi-chip package
- 专利标题(中): 用于测试多芯片封装的方法和电路
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申请号: US13564189申请日: 2012-08-01
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公开(公告)号: US08743638B2公开(公告)日: 2014-06-03
- 发明人: Chun-Hsiung Hung , Wen-Chiao Ho , Kuen-Long Chang
- 申请人: Chun-Hsiung Hung , Wen-Chiao Ho , Kuen-Long Chang
- 申请人地址: TW Hsinchu
- 专利权人: Macronix International Co., Ltd.
- 当前专利权人: Macronix International Co., Ltd.
- 当前专利权人地址: TW Hsinchu
- 代理机构: McClure, Qualey & Rodack, LLP
- 主分类号: G11C7/00
- IPC分类号: G11C7/00
摘要:
A method and circuit for testing a multi-chip package is provided. The multi-chip package includes at least a memory chip, and the memory chip includes a number of memory cells. The method includes performing a normal read operation on the memory cells to check if data read from the memory cells is the same with preset data in the memory cells; and performing a special read operation on the memory cells to check if data read from the memory cells is the same with an expected value, wherein the expected value is independent from data stored in the memory cells.
公开/授权文献
- US20120300562A1 METHOD AND CIRCUIT FOR TESTING A MULTI-CHIP PACKAGE 公开/授权日:2012-11-29
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