Invention Grant
US08743921B2 Light emitting module and thermal protection method 有权
发光模块和热保护方法

  • Patent Title: Light emitting module and thermal protection method
  • Patent Title (中): 发光模块和热保护方法
  • Application No.: US12747170
    Application Date: 2008-12-10
  • Publication No.: US08743921B2
    Publication Date: 2014-06-03
  • Inventor: Jiang Hong Yu
  • Applicant: Jiang Hong Yu
  • Applicant Address: NL Eindhoven
  • Assignee: Koninklijke Philips N.V.
  • Current Assignee: Koninklijke Philips N.V.
  • Current Assignee Address: NL Eindhoven
  • Priority: EP07123317 20071217
  • International Application: PCT/IB2008/055190 WO 20081210
  • International Announcement: WO2009/077932 WO 20090625
  • Main IPC: H01S3/03
  • IPC: H01S3/03
Light emitting module and thermal protection method
Abstract:
Proposed is a light emitting module (1), comprising a semiconductor light emitting device (10) and a thermal switch (20). The thermal switch (20) is arranged to protect the device (10) from over heating. At elevated temperatures the junction of the device (10) may reach a critical level causing catastrophic breakdown of the device. According to the invention, the thermal switch is arranged to shunt the semiconductor light emitting device. This is especially advantageous as the thermal protection offered by the switch (20) correlates directly to the (junction) temperature of the device (10).
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