Invention Grant
- Patent Title: Thermal-fluid-simulation analyzing apparatus
- Patent Title (中): 热流体仿真分析仪
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Application No.: US12805591Application Date: 2010-08-06
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Publication No.: US08744818B2Publication Date: 2014-06-03
- Inventor: Akira Ueda , Junichi Ishimine , Ikuro Nagamatsu , Masahiro Suzuki , Tadashi Katsui , Yuji Ohba , Seiichi Saito , Nobuyoshi Yamaoka , Yasushi Uraki
- Applicant: Akira Ueda , Junichi Ishimine , Ikuro Nagamatsu , Masahiro Suzuki , Tadashi Katsui , Yuji Ohba , Seiichi Saito , Nobuyoshi Yamaoka , Yasushi Uraki
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Staas & Halsey LLP
- Priority: JP2009-205326 20090904
- Main IPC: G06F17/50
- IPC: G06F17/50 ; H05K7/20

Abstract:
A thermal-fluid-simulation analyzing apparatus includes an execution unit that generates an analysis model using analysis conditions to conduct a first thermal fluid simulation analysis based on the generated analysis model, an analysis-condition collecting unit that collects analysis conditions when a predetermined period passes after the first thermal fluid simulation analysis, a condition extracting unit that extracts a boundary condition from the analysis conditions collected by the analysis-condition collecting unit, and a re-execution unit that selects a region corresponding to the boundary condition extracted by the condition extracting unit from regions of the analysis model generated by the execution unit, updates the selected region with the boundary condition, and conducts a second thermal fluid simulation analysis for the updated analysis model.
Public/Granted literature
- US20110060571A1 Thermal-fluid-simulation analyzing apparatus Public/Granted day:2011-03-10
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