Invention Grant
- Patent Title: Elevator door frame with electronics housing
- Patent Title (中): 电梯门框与电子外壳
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Application No.: US13139755Application Date: 2008-12-19
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Publication No.: US08746412B2Publication Date: 2014-06-10
- Inventor: Pascal Rebillard , Nicolas Fonteneau , Xavier Jean-Jacques Lejon
- Applicant: Pascal Rebillard , Nicolas Fonteneau , Xavier Jean-Jacques Lejon
- Applicant Address: US CT Farmington
- Assignee: Otis Elevator Company
- Current Assignee: Otis Elevator Company
- Current Assignee Address: US CT Farmington
- Agency: Carlson, Gaskey & Olds
- International Application: PCT/IB2008/003737 WO 20081219
- International Announcement: WO2010/070378 WO 20100624
- Main IPC: B66B1/34
- IPC: B66B1/34

Abstract:
An exemplary enclosure for housing electronics useful with an elevator system includes a first sidewall and a second sidewall adjacent the first sidewall. A third sidewall is at an oblique angle relative to the first sidewall. The third sidewall provides a support surface for supporting electronics inside the enclosure. The first and second sidewalls are moveable relative to the third sidewall to provide a single opening facing the support surface.
Public/Granted literature
- US20110253483A1 ELEVATOR DOOR FRAME WITH ELECTRONICS HOUSING Public/Granted day:2011-10-20
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