发明授权
- 专利标题： Ultrasonic bonding systems and methods of using the same
- 专利标题（中）： 超声波接合系统及其使用方法
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申请号： US14059572申请日： 2013-10-22
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公开(公告)号： US08746537B2公开(公告)日： 2014-06-10
- 发明人: Christoph B. Luechinger , Orlando L. Valentin , Tao Xu
- 申请人： Orthodyne Electronics Corporation
- 申请人地址： US CA Irvine
- 专利权人： Orthodyne Electronics Corporation
- 当前专利权人： Orthodyne Electronics Corporation
- 当前专利权人地址： US CA Irvine
- 代理商 Christopher M. Spletzer, Sr.
- 主分类号： B23K1/06
- IPC分类号： B23K1/06 ; B23K20/10
摘要：
An ultrasonic bonding system is provided. The ultrasonic bonding system includes a bond head assembly and a bonding tool for bonding a conductive bonding material to a workpiece. The ultrasonic bonding system also includes a pressing member adapted to press against the workpiece, the pressing member being supported by the bond head assembly and being moveable with respect to the bond head assembly independent of the bonding tool. The pressing member includes a body portion and a plurality of pressing elements extending below the body portion, the pressing elements being configured to contact the workpiece.
公开/授权文献
- US20140048584A1 ULTRASONIC BONDING SYSTEMS AND METHODS OF USING THE SAME 公开/授权日：2014-02-20
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