Invention Grant
- Patent Title: Backlight module
- Patent Title (中): 背光模组
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Application No.: US13471435Application Date: 2012-05-14
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Publication No.: US08746946B2Publication Date: 2014-06-10
- Inventor: Ci-Guang Peng , Cheng-Yu Wang , Chung-Yang Hung , Te-Hen Lo , Cheng-Min Tsai , Ming-Sheng Lai , Ren-Wei Huang , Shu-Ting Jhuang
- Applicant: Ci-Guang Peng , Cheng-Yu Wang , Chung-Yang Hung , Te-Hen Lo , Cheng-Min Tsai , Ming-Sheng Lai , Ren-Wei Huang , Shu-Ting Jhuang
- Applicant Address: TW Hsinchu
- Assignee: Au Optronics Corporation
- Current Assignee: Au Optronics Corporation
- Current Assignee Address: TW Hsinchu
- Agency: Jianq Chyun IP Office
- Priority: TW100147746A 20111221
- Main IPC: F21V7/04
- IPC: F21V7/04 ; F21V8/00

Abstract:
A backlight module including a light guide plate and a light source is provided. The light guide plate has a light incident surface, a light reflection surface, a first side surface and a second side surface. The light incident surface is connected to the second side surface. The reflection surface is connected between the first side surface and the light incident surface. The first and the second side surfaces are two planes with their extending planes intersected. The light incident surface is a chamfering plane connected between the first and the second side surfaces. The light reflection surface is a cambered surface connected between the first side surface and the light incident surface. The light source is disposed next to the light incident surface, so as to transmit light into the light guide plate through the light incident surface.
Public/Granted literature
- US20130163279A1 BACKLIGHT MODULE Public/Granted day:2013-06-27
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