发明授权
- 专利标题： Cleaning residual molding compound on solder bumps
- 专利标题（中）： 在焊料凸块上清洁残留的模塑料
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申请号： US13198767申请日： 2011-08-05
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公开(公告)号： US08748306B2公开(公告)日： 2014-06-10
- 发明人: Yi-Yang Lei , Hung-Jui Kuo , Chung-Shi Liu , Mirng-Ji Lii , Chen-Hua Yu
- 申请人： Yi-Yang Lei , Hung-Jui Kuo , Chung-Shi Liu , Mirng-Ji Lii , Chen-Hua Yu
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Duane Morris LLP
- 主分类号： H01L21/44
- IPC分类号： H01L21/44 ; H01L23/22 ; H01L23/48
摘要：
A method of forming wafer-level chip scale packaging solder bumps on a wafer substrate involves cleaning the surface of the solder bumps using a laser to remove any residual molding compound from the surface of the solder bumps after the solder bumps are reflowed and a liquid molding compound is applied and cured.
公开/授权文献
- US20130034956A1 CLEANING RESIDUAL MOLDING COMPOUND ON SOLDER BUMPS 公开/授权日：2013-02-07