Invention Grant
- Patent Title: Printed board assembly interface structures
- Patent Title (中): 印刷电路板组装接口结构
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Application No.: US13179091Application Date: 2011-07-08
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Publication No.: US08748750B2Publication Date: 2014-06-10
- Inventor: Lance L. Sundstrom , Michael J. Gillespie , Rainer Blomberg
- Applicant: Lance L. Sundstrom , Michael J. Gillespie , Rainer Blomberg
- Applicant Address: US NJ Morristown
- Assignee: Honeywell International Inc.
- Current Assignee: Honeywell International Inc.
- Current Assignee Address: US NJ Morristown
- Agency: Shumaker & Sieffert, P.A.
- Main IPC: H05K1/16
- IPC: H05K1/16

Abstract:
Example printed board assembly (PBA) interfaces are described. In some examples, the disclosure relates to a printed board (PB) including a conductive layer, where the PB defines a first surface and a recess in the first surface, where a surface defining the recess is at least one of electrically or thermally connected to the conductive layer, and an electrical component body mounted on the PB. The electrical component body may be mounted on the PB such that a surface of the electrical component body extends over at least a portion of the recess, where the recess extends beyond the electrical component body such that the recess defines an aperture for introducing an interface material between the surface of the electrical component body and the surface of the recess.
Public/Granted literature
- US20130010432A1 PRINTED BOARD ASSEMBLY INTERFACE STRUCTURES Public/Granted day:2013-01-10
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