Invention Grant
- Patent Title: Electronic component, electronic device, and method for manufacturing the electronic component
- Patent Title (中): 电子部件，电子设备以及电子部件的制造方法
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Application No.: US13419253Application Date: 2012-03-13
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Publication No.: US08748755B2Publication Date: 2014-06-10
- Inventor: Kazunori Inoue , Tsutomu Miyashita , Kazuhiro Matsumoto
- Applicant: Kazunori Inoue , Tsutomu Miyashita , Kazuhiro Matsumoto
- Applicant Address: JP Tokyo
- Assignee: Taiyo Yuden Co., Ltd.
- Current Assignee: Taiyo Yuden Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Chen Yoshimura LLP
- Priority: JP2011-063365 20110322
- Main IPC: H01L23/28
- IPC: H01L23/28
Abstract:
An electronic component includes: a substrate; a functional portion provided on the substrate; an interconnection line provided on the substrate and electrically connected to the functional portion; a metal wall provided on the substrate so as to surround the functional portion and the interconnection line; and a seal portion that contacts the metal wall and covers the functional portion and the interconnection line so as to define a cavity above the functional portion, the seal portion being made of liquid crystal polymer.
Public/Granted literature
- US20120241211A1 ELECTRONIC COMPONENT, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING THE ELECTRONIC COMPONENT Public/Granted day:2012-09-27
Information query
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