Invention Grant
- Patent Title: Flip-chip optical interface with micro-lens array
- Patent Title (中): 带微透镜阵列的倒装芯片光接口
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Application No.: US13677374Application Date: 2012-11-15
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Publication No.: US08750657B2Publication Date: 2014-06-10
- Inventor: Shmuel Levy , Shai Rephaeli , Rafi Lagziel
- Applicant: Mellanox Technologies Ltd.
- Applicant Address: IL Yokneam
- Assignee: Mellanox Technologies Ltd.
- Current Assignee: Mellanox Technologies Ltd.
- Current Assignee Address: IL Yokneam
- Agency: D. Kligler I.P. Services Ltd.
- Main IPC: G02B6/12
- IPC: G02B6/12 ; G02B6/36 ; G02B6/43

Abstract:
An apparatus includes an optically opaque substrate, which includes first and second opposite surfaces and has one or more openings traversing through the substrate between the first and second surfaces. One or more optical transducers are attached to the first surface of the substrate so as to emit or detect light via the respective openings. One or more lenses are positioned against the respective openings on the second surface of the substrate, and are configured to couple the light between the optical transducers and respective optical fibers.
Public/Granted literature
- US20140133797A1 Flip-chip optical interface with micro-lens array Public/Granted day:2014-05-15
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