发明授权
US08754516B2 Bumpless build-up layer package with pre-stacked microelectronic devices
有权
无堆积的堆叠层封装，带有预先堆叠的微电子器件
- 专利标题： Bumpless build-up layer package with pre-stacked microelectronic devices
- 专利标题（中）： 无堆积的堆叠层封装，带有预先堆叠的微电子器件
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申请号： US12868816申请日： 2010-08-26
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公开(公告)号： US08754516B2公开(公告)日： 2014-06-17
- 发明人: Pramod Malatkar
- 申请人： Pramod Malatkar
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Winkle, PLLC
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
The present disclosure relates to the field of integrated circuit package design and, more particularly, to packages using a bumpless build-up layer (BBUL) designs. Embodiments of the present description relate to the field of fabricating microelectronic packages, wherein a first microelectronic device having through-silicon vias may be stacked with a second microelectronic device and used in a bumpless build-up layer package.
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