发明授权
US08754519B2 Package for housing semiconductor element and semiconductor device using the same
有权
用于壳体半导体元件的封装和使用其的半导体器件
- 专利标题： Package for housing semiconductor element and semiconductor device using the same
- 专利标题（中）： 用于壳体半导体元件的封装和使用其的半导体器件
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申请号： US12978813申请日： 2010-12-27
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公开(公告)号： US08754519B2公开(公告)日： 2014-06-17
- 发明人: Tsuyoshi Hasegawa
- 申请人： Tsuyoshi Hasegawa
- 申请人地址： JP Tokyo
- 专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人地址： JP Tokyo
- 代理机构： Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 优先权： JP2010-022518 20100203
- 主分类号： H01L23/02
- IPC分类号： H01L23/02 ; H01L23/12 ; H01L23/053 ; H01L23/10 ; H01L23/04
摘要：
According to one embodiment, a package for housing semiconductor element includes: a base plate including a top surface and a recessed portion formed as a downwardly-recessed portion of the top surface; a peripheral wall provided on the top surface of the base plate; a lid provided on an upper side of the peripheral wall and forming a semiconductor element housing space in cooperation with the base plate and the peripheral wall; and a feed-through terminal including a bottom end and fixed to the recessed portion so that the bottom end is located at a lower position than the top surface of the base plate except the recessed portion.